Technical Specifications
Capacity: 8GB
Memory Type: DDR4 SO-DIMM
(260-pin)
Frequency: 2666MHz
(PC4-21300)
CAS Latency: CL19
(19-19-19)
Operating Voltage: 1.2V
Chip Configuration:
1024Mx16
Operating Temperature: 0°C
to 85°C
Compatibility:
Supports Intel platforms (Skylake, Kaby Lake, Coffee Lake, Cannon Lake)
and AMD platforms (AM4, TR4)
PCB: Multi-layer PCB for
improved signal stability
Power Efficiency: Up to 20%
lower power consumption compared to DDR3
Compliance: JEDEC standard,
RoHS compliant
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